1. Red gum plays a fixed and non-conductive role. Solder paste is both fixed and conductive,
2. Red glue needs wave soldering to weld
3. Red glue, the temperature of reflow soldering machine is lower, the temperature of solder paste and reflow soldering machine is higher.
4. In the mixed process of SMT and DIP, in order to avoid one-sided reflux and two-time overheating of wave craze, red glue on the waist of chip element on wave craze welding surface of PCB can be used to tin once during wave craze welding, thus eliminating the solder paste printing process.
5. Red gum generally plays a fixed and auxiliary role. Solder paste is the real welding effect, red glue does not conduct electricity, solder paste conducts electricity.
6. The safest, red gum + solder paste double process, that is, the cost is a little high. In the mixed process of SMT and DIP, in order to avoid one-sided reflux and two-time overheating of wave crest, the chip element on the wave crest welding surface of PCB, with red glue on the waist, can be tin-coated once during the wave crest welding, thus eliminating the solder paste printing process. One is red glue and the other is tin paste. Red gum generally plays a fixed and auxiliary role. Solder paste is the real welding function. Red glue does not conduct electricity, solder paste conducts electricity. Red glue, reflow machine temperature is lower. Red glue also needs wave soldering to solder; solder paste, reflow soldering machine temperature is relatively higher.