Composition and properties of thermal conductive silica gel
Thermally conductive silicone is generally used in CPUs, LEDs and other electronic products, mainly to play a role of heat conduction and heat dissipation. So what is the composition of thermal silica to have these special properties? In addition to the characteristics of heat conduction and heat dissipation, what are the characteristics of thermal silica gel?
First, the composition of thermal silica gel:
(1) Polymer silicone oil: Silicone rubber (anti-aging, acid and alkali resistance, service life, stable chemical properties, service life and customer's equipment service life)
(2) Thermally conductive filler: thermal conductivity (conduction efficiency) molecular thermal motion, (IC, the heating body looks smooth, actually not smooth, with the thermal pad is to drive out all the air, fill it up)
(3) Flame retardant filler (1 hydroxy, 2 halogen, 3 decyl phenyl ether)
(4) Crosslinking agent (joining effect)
(5) color glue
Second, product features:
(1) Ability to conduct heat
(2) Excellent chemical stability
(3) Anti-aging performance, long service life
(4) Excellent electrical insulation performance (the ability to withstand high pressure increases with increasing thickness, proportional to linear relationship)
(5) Anti-flame retardant ability
(6) It has good adhesion to metals, glass, ceramic tiles, plastics and other materials.