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How to choose thermal silica gel?
Thermally conductive silicone is a high-end thermal compound that does not solidify and does not conduct electricity. It avoids risks such as short circuits. Its high bonding performance and superior thermal conductivity are currently the best for CPU, GPU and heat sink contacts. Thermal solution. The thermal conductive silica gel can be widely applied to various electronic products, the contact surfaces between the heating elements (power tubes, thyristors, electric heating stacks, etc.) and the heat dissipation facilities (heat sinks, heat sinks, housings, etc.) in the electrical equipment. It acts as a heat transfer medium and is resistant to moisture, dust, corrosion and shock.
The main purpose of selecting a thermally conductive silicone sheet is to reduce the thermal contact resistance between the surface of the heat source and the contact surface of the heat sink.
The thermal conductive silicone sheet can fill the gap of the contact surface well, and the air is extruded out of the contact surface. The air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces. With the supplement of the thermal silica sheet, the contact can be made. Better contact with the face, truly face-to-face contact. The temperature response can achieve the smallest possible temperature difference.
The thermal conductivity of thermal silica gel is relative. Although it has good thermal conductivity in flexible materials, generally in the range of 0.6-1.5W/(m·K), a few properties may be higher, but not more than 2W/( m·K). Compared with water 0.5, vulcanized rubber 0.22, Vaseline 0.184 [1] and so on. But there is no advantage with the 1.5W/(m·K) of cement. Almost all metals have much higher thermal conductivity than thermal silica. The thermal conductivity of gold, silver and copper in the metal is between 330 and 360, and the thermal conductivity of aluminum is around 200. The thermal silica gel itself is not a good conductor of heat. The role of the thermal silica gel is to fill the gap between the heat source and the heat sink. Therefore, the use of thermal silicon is as thin as possible. It can apply 0.1-0.5 mm thick thermal silica to fill the gap, and the effect is much better than the 1 mm thick silica gel.