Main use:
Used for sealing, fixing and bonding of electronic components: (such as power supply, switching power supply, LED, power adapter, audio, lighting, induction cooker and home appliance industry, etc.), this product has passed UL- 940VO flame retardant, environmental protection certification, halogen-free test report, etc.; anti-aging, anti-yellowing, non-corrosive, is the first choice for PCB board and electronic appliance industry, can also adjust the bonding strength and consistency of the product according to customer requirements, and apply In the high-end industries such as high temperature resistance such as electric iron, too much energy, military industry and energy conservation and environmental protection.
Technical characteristics:

Serial number	Performance	Y2044W	Y2044Y	Y2044F	Y2044B	Y2044H
1	Exterior	White paste does not flow	White paste does not flow	White, gray, red	Black paste	White paste does not flow
2	Relative density (g/cm3)	1.30~1.60+0.05	1.30~1.60+0.05	1.30~1.60+0.05	1.30~1.60+0.05	1.30~1.60+0.05
3	Dry time (min)	5~15	5~10	3~5	5~15	5~15
4	Hardness (Shore A)	40~55+5	40~55+5	40~55+5	45~55+5	45~55+5
5	Elongation at break (%)	>100~200	>100~200	>100~200	>100~200	>100~200
6	Shear bond strength (MPa)	>1.5~2.0	>1.5~2.0	>1.5~2.0	>1.5~2.0	>1.5~2.0
7	Tensile strength (MPa)	>0.5~2.5	>0.5~2.5	>0.5~2.5	>0.5~2.5	>0.5~2.5
8	Volume resistivity (ohm)	>1.5 x 10 14th power	>1.5 x 10 14th power	>1.5 x 10 14th power	>1.5 x 10 14th power	>1.5 x 10 14th power
9	Insulation breakdown strength (KV/MM)	>12~20	>12~20	>12~20	>12~20	>12~20
10	Dielectric constant (1.2MHz)	2.8	2.8	2.8	2.8	2.8
11	Dielectric loss factor (1.2MHz)	<0.002	<0.002	<0.002	<0.002	<0.002
12	Temperature range ("c)	-60~200"c	-60~200"c	-60~200"c	-60~200"c	-60~200"c

Instructions for use:
1. Clean the surface and clean the surface of the object to be bonded to remove rust, dust and oil.
2. Glue: Unscrew the cap of the hose, squeeze the hose to the cleaned surface, and stick the object to be adhered.
3, curing: the already bonded part is placed in the air, when the skin is formed, and then the result is solidified from the skin to the inside, within 24 hours (room temperature and 55% relative temperature), the glue layer will be cured 2 -4mm depth, the depth of curing gradually increases with time, due to the longer time required for deep curing, it is recommended that the single component is generally used for thin layer bonding of electronic components. It takes more than 3 days to fully cure the 6MM thick adhesive layer. Time (recommended for two-component type products with thickness greater than 6MM)
4. Do not move, use or pack the parts that are in good condition until they have reached sufficient strength.